KAGA FEI Expands Lineup Of Wireless LAN/Bluetooth Combo Modules

Facilitating the Development of Low-Power Embedded Devices with SDIO Interface

YOKOHAMA, Japan--(BUSINESS WIRE)--KAGA FEI Co., Ltd., a global provider of leading short distance wireless modules, announced today the “WKI611AA1,” a Wi-Fi 6 and Bluetooth-supported wireless LAN/Bluetooth combo module for embedded devices.

This module features a built-in high-performance antenna and has obtained various certifications, allows for the reduction of antenna development time and certification costs when developing industrial IoT devices and home automation devices such as smart building equipment, handy terminals for logistics, surveillance cameras, and home appliances. Using this module enables a faster time-to-market for products.

Supporting Wi-Fi 6 and Bluetooth, this module is suitable for applications that require faster data rates and excellent interference avoidance. Mass production of the module will commence in May 2025.
KAGA FEI will continue to respond to market needs and expand its module lineup.

Product Features
1. NXP Chip Integration
The module adopts the “IW611” chip from NXP Semiconductors, which includes dedicated processors and memory for both the wireless LAN and Bluetooth subsystems, enabling independent real-time protocol processing. Supporting Wi-Fi 6 and capable of communication in both the 2.4GHz and 5GHz bands, it achieves higher throughput, superior network efficiency, lower latency, and a wider communication range compared to existing models.

2. Low Power Consumption
The host interface uses SDIO 3.0 for Wireless LAN and UART for Bluetooth, ensuring low power consumption. Additionally, it features an efficient power management system that supports deep sleep low power mode, making it ideal for applications requiring long-time operation.

3. No Need for Antenna Design and Pre-Certified
Features a built-in wideband, high-efficiency antenna, eliminating the need for antenna design. It has obtained Bluetooth qualification and certifications for Radio Law MIC (Japan), FCC (USA), and ISED (Canada), reducing the time and costs.

Product Availability
Sample	:	December 2024
Start of mass production	:	May 2025

About Trademarks
The product names and other proper nouns mentioned herein are trademarks or registered trademarks of their respective companies.

KAGA FEI website
https://www.kagafei.com/jp/eng/

Disclaimer
Product specifications, service content, etc. stated in the news release are as of the date of announcement and is subject to change without notice.

Contacts

KAGA FEI Co., Ltd.
Solution Business Headquarters
Module Products Division
Email: ml-module_contact@jp.kagafei.com

First published on Thu, Aug 29, 2024

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Tags:

Wi-Fi 6 Bluetooth wireless module embedded devices IoT smart building surveillance cameras home appliances NXP Semiconductors SDIO 3.0 KAGA FEI

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KAGA FEI Expands Lineup Of Wireless LAN/Bluetooth Combo Modules

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