Inplay Unveils 2Nd-Gen Nanobeacon IN120 Soc: Unlocking Game-Changing Efficiency For Smart Label Makers With Integrated Temperature Sensor!

IRVINE, Calif.--(BUSINESS WIRE)--InPlay Inc., a leader in ultra-low-power wireless SoC technologies, announces the upcoming release of its revolutionary second-generation NanoBeacon System-on-Chip (SoC), the IN120. Specifically engineered for high-volume smart label applications, the IN120 delivers unprecedented simplicity, cost savings, and manufacturing efficiency.

The IN120 features an ultra-minimalist design, requiring only one external component—a 26MHz crystal. This design innovation dramatically reduces complexity, enabling significant savings in assembly time, manufacturing costs, and supply chain logistics. Delivered in a bumped wafer Known Good Die (KGD) format, the IN120 integrates effortlessly into existing roll-to-roll RFID inlay manufacturing processes, minimizing the need for new capital investments.

A key highlight of the IN120 is its integrated precision temperature sensor (±1°C accuracy), eliminating the need for an external temperature sensing component typically required in cold chain monitoring and logistics applications. This integrated approach not only lowers component costs but also enhances reliability and simplifies production processes.

"Our new IN120 SoC sets a benchmark for smart label technology," said Jason Wu, Cofounder and CEO of InPlay Inc. "By reducing external components to just one, we have enabled manufacturers to produce smart labels more efficiently and economically, opening the door to broader deployment in logistics, pharmaceuticals, and disposable asset tracking."

Further elevating its practicality, the IN120 supports a broad voltage range from 1.1V to 3.6V, compatible with virtually all battery types, including cost-effective printable batteries (1.5V per cell). This flexibility significantly reduces the cost and footprint of smart labels, making disposable, thin-form-factor solutions economically feasible at high volumes.

InPlay also offers preprogramming services for the IN120, streamlining the manufacturing workflow and dramatically cutting production setup times, further amplifying operational efficiency for manufacturers.

The IN120 is poised to transform smart label applications by significantly lowering barriers related to cost, complexity, and production speed, making active smart labels as economically viable as passive RFID labels, but with vastly superior functionality.

The IN120 SoC will be available for sampling starting Q1'2026, with mass production planned shortly thereafter.

For more information, visit www.inplay-tech.com

InPlay Inc. is a pioneering technology company specializing in the development of advanced wireless communication solutions for the IIoT market. Our products are designed to deliver high performance, ultra-low power consumption, and robust security, addressing the most demanding requirements of industrial and consumer applications.

Contacts

Media Contact:
Emmy Chang
Emmy.chang@inpaly-tech.com