TechDogs-"Faraday Unveils 2.5D/3D Advanced Package Service For Chiplets"

Manufacturing Technology

Faraday Unveils 2.5D/3D Advanced Package Service For Chiplets

By Business Wire

Business Wire
Overall Rating

HSINCHU, Taiwan--(BUSINESS WIRE)--#Chiplets--Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D advanced package service. With an unique interposer manufacturing service for chiplets connection and close collaboration with top-tier foundry and OSAT suppliers to secure capacity, yield, quality, reliability, and schedule in production, Faraday assures seamless integration of multi-source dies, leading to project success.

Faraday goes beyond technology by offering flexible business models tailored to each customer's unique 2.5D/3D package project needs. Positioned neutrally and strategically, Faraday enhances flexibility and efficiency in advanced package service for multi-source chiplets, packaging, and manufacturing. In a long-term partnership with leading semiconductor foundry UMC and premier OSAT vendors in Taiwan, Faraday is capable of supporting custom passive/active interposer manufacturing with TSV, and proficiently managing 2.5D/3D package logistics.

Furthermore, Faraday deeps dive into package feasibility studies of chiplets and interposer based on the die information including die size, TSV, bump pitch and count, floorplan, substrate, power analysis, and thermal simulation. This comprehensive analysis not only comes up with an optimal package structure for each project in the early stage but also increases the success probability of the advanced package.

“Faraday empowers customers to redefine the possibilities of chip integration,” said Flash Lin, COO of Faraday. “Leveraging our SoC design expertise and backed by a 30-year experience of sustainable supply chain management, we are committed to production quality bearing in mind the exacting demands of the advanced package market.”

About Faraday Technology Corporation

Faraday Technology Corporation (TWSE: 3035) is a leading ASIC design service and IP provider, certificated to ISO 9001 and ISO 26262. The broad silicon IP portfolio includes I/O, Cell Library, Memory Compiler, ARM-compliant CPUs, LPDDR4/4X, DDR4/3, MIPI D-PHY, V-by-One, USB 3.1/2.0, 10/100 Ethernet, Giga Ethernet, SATA3/2, PCIe Gen4/3, and 28G programmable SerDes, etc. Headquartered in Taiwan, Faraday has service and support offices around the world, including the U.S., Japan, and China. For more information, visit or follow Faraday on LinkedIn.


Faraday Tech, Evan Ke, +886 3 578 7888 ext. 88689,

First published on Tue, Sep 12, 2023

Enjoyed what you've read so far? Great news - there's more to explore!

Stay up to date with the latest news, a vast collection of tech articles including introductory guides, product reviews, trends and more, thought-provoking interviews, hottest AI blogs and entertaining tech memes.

Plus, get access to branded insights such as informative white papers, intriguing case studies, in-depth reports, enlightening videos and exciting events and webinars from industry-leading global brands.

Dive into TechDogs' treasure trove today and Know Your World of technology!

Disclaimer - Reference to any specific product, software or entity does not constitute an endorsement or recommendation by TechDogs nor should any data or content published be relied upon. The views expressed by TechDogs’ members and guests are their own and their appearance on our site does not imply an endorsement of them or any entity they represent. Views and opinions expressed by TechDogs’ Authors are those of the Authors and do not necessarily reflect the view of TechDogs or any of its officials. All information / content found on TechDogs’ site may not necessarily be reviewed by individuals with the expertise to validate its completeness, accuracy and reliability.


Faraday Technology Semiconductor Manufacturing Chiplets Connection


Join The Discussion

  • Dark
  • Light