Thermal and Signal Integrity Analysis of Multi-Die Packages for CPO

Name: Thermal and Signal Integrity Analysis of Multi-Die Packages for CPO
Start: 2024-11-14T00:00:00+00:00
End: 2024-11-14T00:00:00+00:00

By Ansys

Overall Rating

Event Type

Virtual

Date

Nov 14, 2024

Time

14:00

Event Linkhttps://www.ansys.com/en-in/webinars/thermal-signal-integrity-analysis-multi-die-packages

About Event

Join us on November 14th as we demonstrate a highly efficient, accurate, chip-centric, system-aware thermal simulation workflow for multi-die packages using Ansys RedHawk SC ET and Icepak. We'll show a comprehensive electro-optical simulation workflow with Ansys HFSS, AEDT, and Lumerical INTERCONNECT to capture packaging effects on the signal integrity of systems within a multi-die package.

Tags:

Edge ComputingMulti-Chip Packaging Co-Packaged Optics Thermal Solutions Signal Analysis Semiconductor Industry Design Optimization Engineering Best Practices Electronics Engineering Thermal Simulation IC Design

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