Event Concluded

TechDogs-"Die Attach Quality In Semiconductor Packaging: Utilizing Thermal Transient Testing To Improve Manufacturing"

Manufacturing Technology

Die Attach Quality In Semiconductor Packaging: Utilizing Thermal Transient Testing To Improve Manufacturing

By Siemens

Siemens
Overall Rating

Webinar

Mar 1, 2023

09:30 PM GMT+5:30

About Event

Continuous improvements in quality and reduction in early life failures are key goals for semiconductor manufacturers and their customers. Companies involved in the vehicle electrification, server, military and defense and consumer goods are the most sensitive. Historically, semiconductor companies would deploy early life failure reduction efforts with electrical tests or geospatial techniques to reject or test out potential failures. Burn-in and predictive test techniques like part average testing have been around for a long time. Additionally, other geospatial methods such as visual defect screening and algorithmic yield clustering looking for abnormal patterns are used to predict early life failures.

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