Name: 2024 TSMC Open Innovation Platform Ecosystem Forum
Start: 2024-11-19T00:00:00+00:00
End: 2024-11-19T00:00:00+00:00

Event Concluded

TechDogs-"2024 TSMC Open Innovation Platform Ecosystem Forum"

Event Type

In-Person

Location

Schiphol, Netherlands

Date

Nov 19, 2024

Time

6:30

Event Linkhttps://tsmc-signup.pl-marketing.biz/attendees/2024oip/eu/

About Event

The latest advancements in emerging node design challenges, including A16, N2, and N3 processes, are paired with corresponding design flows and methodologies. TSMC’s 3DFabric™ chip stacking and advanced packaging processes, including InFO, CoWoS®, and SoIC, are driving innovation, along with the 3DFabric Alliance and the 3Dblox™ standard. These developments are further enhanced by 3Dblox-based design enablement technologies targeting HPC, AI/ML, and mobile applications. Additionally, TSMC offers comprehensive design solutions for specialty technologies focused on ultra-low power, ultra-low voltage, analog migration, RF, mmWave, and automotive designs for 5G, automotive, and IoT markets. AI-assisted design flows for 2D and 3DIC designs optimize productivity and efficiency, while real-world applications from TSMC’s Open Innovation Platform® Ecosystem members and customers help accelerate time-to-design and time-to-market.

Tags:

Artificial Intelligence (AI)GT Industry Insider California Department of Public Health CDPH IT leadership IT leadership briefing public health IT California IT leaders digital transformation CDPH innovation technology innovation health IT strategies

Join The Discussion

Emerging Technology